




This patented advanced cold lamination process encapsulates various types of PCB assemblies—including those with BLE modules, fingerprint sensors, or embedded batteries—under precisely controlled temperature and pressure. The result is a highly durable, ultra-slim package that can be customized to the size of a banking card or any unique shape or design, ideal for next-generation secure and compact electronic devices.

A patented advanced lamination process to package different types of PCBA with components such as BLE module or fingerprint sensor, or battery under perfectly contolled temperature or pressure into banking card size or any shape or design.

A compact, lightweight electronic ID badge featuring a 3.7-inch E Ink (Electronic Ink) display, designed for professional environments. The energy-efficient E Ink screen provides paper-like readability (even in sunlight) and ultra-low power consumption, enabling long-term use without frequent charging.









This patented advanced cold lamination process encapsulates various types of PCB assemblies—including those with BLE modules, fingerprint sensors, or embedded batteries—under precisely controlled temperature and pressure. The result is a highly durable, ultra-slim package that can be customized to the size of a banking card or any unique shape or design, ideal for next-generation secure and compact electronic devices.

A patented advanced lamination process to package different types of PCBA with components such as BLE module or fingerprint sensor, or battery under perfectly contolled temperature or pressure into banking card size or any shape or design.

A compact, lightweight electronic ID badge featuring a 3.7-inch E Ink (Electronic Ink) display, designed for professional environments. The energy-efficient E Ink screen provides paper-like readability (even in sunlight) and ultra-low power consumption, enabling long-term use without frequent charging.
