OEM/ODM Cold Laminating Technology

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Cold Laminating Series

OEM/ODM Cold Laminating Technology

OEM/ODM Processing/ Lamination/Integration for Active Electronic Smart Card of biometric/authentic/IOT/OTP/FP developer Board

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Product Details

Product Parameters

OEM/ODM Cold Laminating Technology

OEM/ODM Processing/ Lamination/Integration for Active Electronic Smart Card of biometric/authentic/IOT/OTP/FP developer Board

Introduction to Cold laminating Card

The Cold laminating card adopts low temperature lamination technology (cold lamination technology). The internal structure of the cold laminating card is mainly composed of PCB circuit board, lithium polymer battery, IC integrated chip, and Bluetooth function module.

Function introduction: The working status of the card can be controlled through the Bluetooth connection of the mobile phone, and the security information and consumption information of the card can be grasped at any time.

Product Description
√ Sensor Pixel size : 131x132
√ Sensor Resolution: 350dpi
√ Module size : 81 x 49(mm)
√ Secure Element MCU
√ Dual Interface
√ No Battery
√ No Supercapacitor

Fast performance
√ Authentication Speed : ~ 0.7s (max), 0.5s (avg)
√ Template size : 0.5k per 1 ID

Cold lamination technology is easy to ensure the fingerprint inlay performance and laminate into thin card of CR80 size.

Spec.	UIF300 Module (Flexible)
Sensor Pixel	131 x 132
Sensor Resolution	350dpi
Sensor Size	14.7 x 14.7 x 0.6mm
Algorithm MCU	Cortex-M4
Response Time	600ms
FAR (False Acceptance Rate)	< 0.001% (Security Level 3)
FRR (False Rejection Rate)	< 1% (Security Level 3)
Fingerprint Capacity	< 5
Communication I/F	ISO7816 & I2C
Operating Voltage	+2.5V or +3.3V
Standby Current	< 1mA
Operating(Match) Current	< 8mA
Operating Temp.	-10°C ~ +50°C
Module Size	81 x 49mm
Lamination	85.6 x 53.8mm (ISO 7816)
Recognition distance	2cm (contactless) / HID OMNIKEY5421
Strong Point	No Battery, No Supercapacitor

Some Solutions You Can Choose

1. Customers provide a complete set of Circuit Boards and Components, and our company is responsible for Packaging into cards
2. The customer provides the Main Components, BOM list and Design Principles. Our company is responsible for PCB design other components procurement,PCB production, component patch welding, and finally packaging into cards
3. Customers provide design ideas,all other processes are completed by our company.

Remarks: Our fingerprint smart card could be used for high secured access control and payment which could store biometric data and personal data.

Process Comparison of Cold Laminating Card and Traditional Injection Card
	Cold Laminating Card	Traditional Injection Card
Cost of production	1. Low cost 2. Suitable for small batch diversified production needs	Tens of thousands of mold fees
Card thickness	1.The card is thin 2.The general thickness is 0.84-1.6mm 3.Easy to carry and use	1. 3-8mm
Card Size
Layout printing	The surface of the card is suitable for printing in various colors, and like the credit card	screen printing only
Wastage	1. It can be laminated at 50 ℃, and has no effect on the temperature of electronic components and batteries. 2. High temperature resistant materials are used on both sides of the circuit board to effectively isolate the higher temperature battery and impact of the life of electronic components.	Can not effectively isolate the outside temperature, traditional lamination is easy to cause the battery and electronic components over temperature high and damaged.